DiaPlus is a 5th generation bonding agent with high bonding strength. Optimizes the enamel etching procedure in conjunction with all light-curing restorative materials. Designed for both direct and indirect applications (enamel, dentin, porcelain, ceramics, amalgam, etc.). Low film thickness prevents adhesive show-through and creates a beautiful final restoration. Compatible with dual- and self-cure composites and core materials. **For further product information, please contact Chat Support**