- All bond universal is the ideal chemical formulation for both self-etch and total-etch adhesion. - Indicated for direct and indirect restorations. - Contains mdp monomers for enhanced durability. - Ultra mild acidity (pH > 3) allows for universal compatibility with dual-cured and self-cured materials. - Hydrophobic formula (resin friendly) results in improved durability of the bond. - Low film thickness allows the adhesive to readily flow into etched surfaces and offers both chemical and mechanical sealing. **For further product information, please contact Chat Support**