Hack-saw frame designed to remove excesses of composites, adhesives, cements and amalgams from proximal areas. - For inlay and onlay procedures and laminated veneers. - Easy and safe way to remove surplus materials without damaging the contact point. - Saw blade removes excesses of any type of filling materials from the interproximal areas, without breaking the contact point due its thickness of only 0.05 mm. - Diamond strips allows to perform the stripping in orthodontic procedures. - Easy and safe handling. **For further product information, please contact Chat Support**