معلومات المنتج

Hack-saw frame designed to remove excesses of composites, adhesives, cements and amalgams from proximal areas. Indicated for inlay and onlay procedures and laminated veneers. Easy and safe way to remove surplus materials without damaging the contact points. Saw blade removes excesses of any type of filling materials from the interproximal areas, without breaking the contact point due its thickness of only 0.05 mm. Diamond strips allows to perform the stripping in orthodontic procedures. Easy and safe handling. All components are autoclavable. **For further product information, please contact Chat Support**